PFA Foam PF430

Superior Micro-Coaxial PFA Foam Resin

Everflon+ PFA PF430

Engineered with an optimized high melt flow rate range (MFR 25~45) and superior thermal stability to meet the demand for superior micro-coaxial designs and compact electronic devices with minimal distortion.

Advanced PFA Technology for Compact Electronics

Everflon+ PFA PF430 combines extreme thermal resistance with high-speed processing capabilities for ultra-thin wire and cable solutions.

01

High Melt Flow (MFR 25~45)

Features an optimized MFR range of 25 to 45 to enable high processing speeds and excellent flow characteristics required for fine-gauge wire extrusions.

02

Superior Thermal Stability

Offers exceptional heat resistance and a higher melting point (305 °C), ensuring long-term durability in high-temperature operating environments.

03

Low Loss & High-Speed Data

Provides high-speed data transmissions with minimal distortion, exceptional signal return loss, and superior attenuation performance.

Industry Applications

Designed to meet the stringent demands of micro-coaxial designs and compact electronic devices.

Micro-Electronics

Micro-Coaxial Cables

Perfect for ultra-thin wire applications where conductor sizes are 26 AWG or smaller and wall thicknesses are 0.002 in or greater.

High-Speed Data

Compact Electronic Devices

Enables high-speed data transmission with exceptional return loss and low attenuation performance in space-constrained assemblies.

Advanced Engineering

Low-Loss & Larger Conductors

Offers opportunities for miniaturization, weight savings, or the use of larger conductors to build low-loss cables without increasing dielectric dimensions.

Technical Property Data

Typical physical, processing, and electrical characteristics for Everflon+ PFA PF430 resin.

Property DescriptionTest MethodUnitTypical Value
Processing & Rheology
Melt Flow Rate (MFR at 372 °C / 5.0 kg)ASTM D3307 / ISO 12086g / 10 min25~45
Melting PointASTM D4591°C (°F)305 (580)
Specific GravityASTM D792 / ISO 11832.14
Electrical Properties
Dielectric Constant (1 kHz / 1 MHz / 1 GHz)ASTM D150 / IEC 2502.04
Dissipation Factor (1 kHz)ASTM D150 / IEC 2500.0001
Dissipation Factor (1 MHz)ASTM D150 / IEC 2500.0002
Dissipation Factor (1 GHz)ASTM D2520 / IEC 2500.0004

Extrusion & Processing Guide

Optimized for conventional melt extrusion and single-screw extruders with nitrogen gas injection.

Step 01

Equipment Materials

Molten fluoroplastics are corrosive; all contact parts must use high-nickel, low-iron alloys suitable for fluoroplastic processing.

Step 02

Void Content Control

Void content (up to 55%) is regulated by nitrogen flow rate, temperatures, and quench point. Voids should grow after melt draw-down onto the wire.

Step 03

Process Monitoring

The extrusion line should incorporate specialized devices to monitor diameter, capacitance, and gas flow accurately.

Step 04

Packaging & Storage

Supplied as pellets packaged in 25-kg (55-lb) plastic bags. Store under ambient conditions to avoid airborne contamination and moisture.

Safety Precaution

Handling & Ventilation

Process only in well-ventilated areas using local exhaust ventilation (LEV). Vapors and fumes liberated during hot processing must be exhausted completely.

Avoid tobacco contamination. Inhaling fumes from contaminated tobacco can cause polymer fume fever (chills, fever, sore throat), which typically passes within 24 hours.

Regulatory Notice

Authorization & Medical Use

Customers wishing to process these products should consult sales representatives to obtain a license authorizing the processing of cable primaries.

Caution: Do not use or resell materials in medical applications involving human body implantation without a written agreement covering such use.

Foamed PFA. More Than Lightweight.

Lighter. Smarter. More Possibilities.

Beyond PFA. A Complete World of Possibilities.

Significant Others

Everflon™+ PFA Color Concentrate

Everflon™+ PFA Compound

Everflon™ PFA Aqueous Dispersion

Everflon™ PFA Roto Molding Powder

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