PFA High Purity GC420
Ultra-High Flow Semiconductor-Grade Fluoropolymer
Everflon™ PFA GC420
Engineered with ultra-high melt flow index (MFI 20–30 g/10 min) for rapid thin-wall cavity filling, complex micro-precision molding, and high-speed wire coating without sacrificing sub-nanometer purity.
Ultra-high flow engineered for intricate precision.
Optimized rheology delivers rapid mold filling, lower clamp pressures, and defect-free micro-molded semiconductor components.
20–30 MFI
Ultra-High Melt Flow Rate
Exceptional molten fluidity drastically reduces injection cycle times and enables effortless filling of complex, multi-cavity, and long-path micro mold geometries.
0.1 mm
Ultra-Thin Wall Capabilities
Facilitates high-speed extrusion of ultra-thin wire coatings and sub-millimeter injection molding with uniform wall thickness and zero knit-line embrittlement.
260°C (500°F)
Continuous Service Stability
Maintains chemical resistance, high dielectric strength, and low dissipation factor (<0.0002) even when exposed to continuous high-temperature semiconductor processing.
Cleanroom Precision & End-Group Stability
High-Flow Purity Metrics
Advanced molecular fluorination eliminates unstable chain ends, ensuring zero ionic leaching and low chemical outgassing.
< 10 ppt
Critical Metal Purity
Extremely low baseline levels for critical metallic ions (Fe, Cu, Ni, Cr, Zn, Ca), safeguarding wafer yields across sub-2nm nodes.
Near-Zero
Low TOC & Outgassing
Complete end-group conversion into stable $-CF_3$ structures prevents organic volatile release and bubbling during fast injection molding.
Ra < 0.1 μm
Micro-Surface Smoothness
Non-porous, smooth molded finishes prevent chemical entrapment and particle shedding, speeding up cleanroom flush-out protocols.
100% Neat
Additive-Free Resin
Virgin perfluoroalkoxy fluoroplastic with no processing aids, providing superior optical clarity and unmatched chemical resistance.
High-Precision Injection & Extrusion Applications
Semiconductor & Electronic Systems
Optimized for high-speed automated manufacturing of micro-precision components.
01
Micro-Precision Injection Moldings
High melt flow index (20-30 MFI) provides complete filling of micro-fittings, valve needles, multi-port connectors, and wafer retaining rings.
02
High-Speed Wire & Cable Insulation
Enables ultra-fast crosshead wire extrusion, offering void-free, ultra-thin insulation for semiconductor sensor cables and aerospace data lines.
03
Thin-Walled Chemical Components
Ideal for molding intricate spray nozzles, chemical filters, porous membranes, and high-purity sensor housings with sub-millimeter tolerances.
04
High-Density Semiconductor Sockets
Delivers superior electrical insulation and thermal stability for IC test sockets, burn-in connectors, and high-frequency microwave devices.
SEMI F57 & FDA 21 CFR 177.1550 Standards Compliance
Everflon™ PFA GC420 meets SEMI F57 specifications for high-purity chemical distribution and conforms to FDA 21 CFR 177.1550 and European Regulation (EU) No. 10/2011 for food and ultra-pure fluid contact.
Technical Specifications
Nominal property values for Everflon™ PFA GC420 ultra-high flow semiconductor-grade resin.
| Property Parameter | Test Standard | Unit | Typical Value |
|---|---|---|---|
| Melt Flow Index (372°C / 5.0 kg) | ASTM D3307 / ISO 12086 | g/10 min | 25.0 (20.0 – 30.0) |
| Specific Gravity | ASTM D792 | — | 2.15 |
| Tensile Strength (23°C / 73°F) | ASTM D3307 / D638 | MPa (psi) | 24 (3,480) |
| Tensile Strength (250°C / 482°F) | ASTM D3307 / D638 | MPa (psi) | 8.5 (1,230) |
| Ultimate Elongation (23°C) | ASTM D3307 / D638 | % | 300 |
| Melting Peak Temperature (DSC) | ASTM D4591 | °C (°F) | 305 (581) |
| Flexural Modulus (23°C) | ASTM D790 | MPa (psi) | 580 (84,100) |
| Dielectric Constant (1 MHz) | ASTM D150 | — | 2.03 |
Precision Fabrication Guidelines & Clean Logistics
Packaging & Processing
Class 100 cleanroom packaging matched with high-productivity injection and high-speed crosshead extrusion.
Cleanroom Double-Sealed Packaging
Packed in anti-static, multi-layer cleanroom-grade polyethylene bags (25 kg / 55 lb net) housed inside rigid, sealed drums to completely prevent airborne particulate contamination and moisture pickup.
Injection & Melt Temperature
Typical melt processing temperatures range from 340°C to 380°C (644°F – 716°F). Owing to the high MFI, lower injection pressures can be used; melt temperature must not exceed 400°C (752°F).
Corrosion-Proof Tooling
All melt contact parts (injection screws, barrels, runner nozzles, crosshead wire dies) must be manufactured from high-nickel alloys such as Hastelloy® C-276 or Inconel® 625.
Recommended Injection Molding Temperature Profile
Rear (Feed Zone): 320°C – 340°C | Middle (Compression): 340°C – 360°C | Front (Metering): 355°C – 375°C | Nozzle & Mold: 365°C – 380°C (Mold Temp: 150°C – 220°C)
Nothing Between You and Pure.
Engineered for the moments when purity leaves no room for compromise.
Beyond PFA. A Complete World of Possibilities.
Significant Others
Everflon™+ PFA Color Concentrate
Everflon™+ PFA Compound
Everflon™ PFA Aqueous Dispersion
Everflon™ PFA Roto Molding Powder
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