Extreme-Flow Semiconductor-Grade Fluoropolymer

Everflon™ PFA GC430

Engineered with extreme melt fluidity (MFI 35–45 g/10 min) for instantaneous cavity filling in intricate micro-moldings, ultra-fine wire insulation, and advanced filtration media with zero compromise on sub-nanometer cleanroom purity.

Extreme fluidity for maximum processing speed.

Tailored rheological properties unlock lightning-fast line speeds, exceptionally low melt viscosity, and defect-free micro-injection molding.

35–45 MFI

Extreme Melt Flow Index

Industry-leading melt mobility allows instantaneous filling of high-aspect-ratio micro-cavities, dramatically shortening overall cycle times and lowering hydraulic clamp loads.

AWG 40+

Ultra-Fine Wire Coating

Unsurpassed draw-down performance facilitates ultra-high speed crosshead wire insulation down to microscopic diameters without spark failures or concentricity errors.

260°C (500°F)

Continuous Service Stability

Exceptional thermal stability and mechanical integrity withstand direct soldering temperatures and harsh chemical environments without degradation.

Cleanroom Precision & End-Group Stability

Extreme-Flow Purity Metrics

Advanced post-polymerization fluorination neutralizes reactive end-groups to deliver ppb/ppt level purity with minimal outgassing.

< 10 ppt

Sub-PPT Metal Purity

Stringent baseline control for 20+ critical metallic ions prevents wafer and chemical contamination across leading-edge fab nodes.

Near-Zero

Minimal Outgassing & TOC

Complete conversion to stable $-CF_3$ terminations prevents void formation, polymer degradation, and volatile organic compound generation.

Ultra-Smooth

Pore-Free Morphology

Smooth micro-surfaces eliminate dead zones, chemical holdup, and particulate entrapment in sensitive filtration components.

100% Neat

Zero Additives

Contains no plasticizers, lubricants, or processing aids, guaranteeing non-leaching performance in hostile chemical environments.

Extreme High-Speed & Micro-Molding Applications

Micro-Precision Semiconductor Systems

Purpose-built for demanding high-volume manufacturing of sub-millimeter parts and micro-insulation.

Ultra-Fine Wire & Coaxial Cable Insulation

High draw-down ratio permits high-speed continuous extrusion of pinhole-free insulation for medical sensor probes, micro-coaxial cables, and aerospace wiring.

Complex Thin-Wall Chemical Filter Cages

Low melt viscosity allows effortless injection molding of complex chemical filter cores, support cages, and porous membrane housings.

Micro-Fluidic Nozzles & Manifolds

Achieves crisp detail and uniform shrinkage in precision chemical dispensing nozzles, micro-valves, and analytical chromatography components.

High-Density Multi-Pin Connectors

Delivers void-free encapsulation, superior dielectric breakdown resistance, and non-stick properties for high-speed automated electronic packaging.

SEMI F57 & FDA 21 CFR 177.1550 Compliance

Everflon™ PFA GC430 conforms to SEMI F57 guidelines for ultra-pure fluid contact components and satisfies FDA 21 CFR 177.1550 and European Union Regulation (EU) No 10/2011 requirements for food and ultra-pure chemical service.

Technical Specifications

Nominal property values for Everflon™ PFA GC430 extreme-flow fluoropolymer resin.

Property Parameter	Test Standard	Unit	Typical Value
Melt Flow Index (372°C / 5.0 kg)	ASTM D3307 / ISO 12086	g/10 min	40.0 (35.0 – 45.0)
Specific Gravity	ASTM D792	—	2.15
Tensile Strength (23°C / 73°F)	ASTM D3307 / ISO 12086	MPa (psi)	25 (3,600)
Ultimate Elongation (23°C / 73°F)	ASTM D3307 / ISO 12086	%	350
Melting Peak Temperature (DSC)	ASTM D4591	°C (°F)	305 (581)
Flexural Modulus (23°C)	ASTM D790 / ISO 178	MPa (psi)	690 (100,000)
MIT Folding Endurance (0.2 mm Film)	ASTM D2176	Cycles	4,000
Dielectric Strength (0.25 mm)	IEC 243 / ASTM D149	kV/mm (V/mil)	80 (2,000)
Dielectric Constant (1 MHz)	IEC 250 / ASTM D150	—	2.03

Fabrication Guidelines & Clean Logistics

Packaging & Processing

Cleanroom Class 100 sealed packaging coupled with high-speed melt processing parameters.

Cleanroom Packaging

Delivered in double-layer anti-static cleanroom polyethylene bags (25 kg / 55 lb net) housed within heavy-duty sealed drums to eliminate ambient particulate contamination and moisture condensation.

Melt Temperature Window

Processing temperatures typically range from 340°C to 385°C (644°F – 725°F). Due to very low melt viscosity, reduced injection pressure and elevated line speed can be achieved; keep melt below 400°C (752°F).

Corrosion-Resistant Metals

All metallic melt-wetted parts (reciprocating screws, barrels, crosshead wire dies, hot runners) must be constructed from high-nickel alloys like Hastelloy® C-276 or Inconel® 625.

Recommended Extrusion & Injection Molding Profiles

Rear (Feed): 320°C – 340°C | Middle (Transition): 340°C – 365°C | Front (Metering): 360°C – 380°C | Die / Crosshead: 370°C – 390°C (Mold: 150°C – 220°C)