PFA 420
Everflon™ PFA 420
Ultra-high melt flow resin engineered for micro-precision injection molding, intricate geometries, and rapid thin-wall extrusion in advanced electronics.
Typical MFR of 25 g/10 min enables effortless filling of complex molds and rapid cycle times in high-volume production.
Perfect for small semiconductor components, intricate connectors, and thin-walled wire insulation with minimal thermal stress.
Fully fluorinated polymer chains minimize fluoride ion outgassing, ensuring semiconductor-grade fluid and signal purity.
Maintains ultra-low dielectric constant and loss tangent from cryogenic temperatures up to continuous 260°C (500°F) operation.
Compliance & Quality
Compliant for direct contact with food, ultra-pure water, and pharmaceutical processing systems across the U.S.
Formulated without hazardous heavy metals or restricted additives, supporting environmentally responsible production.
Self-extinguishing non-flammable polymer structure with low heat release and minimal smoke generation.
Strict lot-to-lot consistency controls to satisfy rigorous cleanroom manufacturing standards.
Specifications
| Property | Test Method | Value (Standard / Imperial) |
|---|---|---|
| Melt Flow Rate (MFR) | ASTM D3307 / ISO 12086 | 22 – 28 g / 10 min (Typ. 25) |
| Melting Point | ASTM D4591 / DSC | 304 – 306 °C (580 – 583 °F) |
| Tensile Strength (23°C / 73°F) | ASTM D1708 / D3307 | 24 – 30 MPa (3,500 – 4,350 psi) |
| Ultimate Elongation | ASTM D1708 / D3307 | 300 – 400 % |
| MIT Folding Endurance (0.20mm film) | ASTM D2176 | 10,000 Cycles |
| Continuous Service Temp | UL Thermal Aging | 260 °C (500 °F) |
| Flammability Rating | UL 94 | V-0 |
Manufacturing
Designed for fast mold-filling of complex shapes and micro-parts with thin walls, reducing cycle times substantially.
Recommended Melt Temp: 360°C – 390°C (680°F – 734°F)
Corrosion-resistant alloys required for screws & barrels
Low shear stress prevents material degradation during rapid injection
Ideal for high-speed wire coating and fine tubing where rapid melt flow is essential for dimensional uniformity.
High drawdown ratios achievable without melt fracture
Superior wall thickness consistency at high line speeds
Excellent melt stability under continuous thermal processing
Empowering micro-electronics, semiconductor fabrication, and high-frequency communication.
Complex wafer-handling components, mini-valves, fittings, and wafer baskets requiring ultra-low fluoride ion leaching.
High-speed extrusion for ultra-thin high-frequency signal wires, miniature coaxial cables, and automotive sensor cabling.
High-density multi-cavity injection molded parts, thin-walled sleeves, and chemical seals with sharp detail requirements.
Logistics & Quality Control
Everflon™ PFA 420 is delivered as uniform, dust-free pellets in hermetically sealed packaging designed to uphold semiconductor-grade purity.
Standard Package: 25-kg (55.1 lbs) heavy-duty bags featuring an internal anti-static PE liner.
Storage Stability: Indefinite shelf life in clean, ambient indoor conditions away from direct humidity.
Freight Class: Standard U.S. freight classification as "Plastics, Materials, Pellets".
Sustainability
Shorter molding cycles, lower processing temperatures, and zero material waste ensure Everflon™ PFA 420 minimizes your factory’s carbon footprint.
Faster mold cycle times significantly cut energy usage per molded unit during mass production.
Fully fluorinated end-groups reduce volatile emissions, safeguarding workplace safety and surrounding ecosystems.
High thermal stability allows clean regrind integration in approved non-critical molded parts without property drop.
Everflon™ is a trademark of Everflon Fluoropolymers. All rights reserved.
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Significant Others
Everflon™+ PFA Color Concentrate
Everflon™+ PFA Compound
Everflon™ PFA Aqueous Dispersion
Everflon™ PFA Roto Molding Powder
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