Ultra-High Purity Fluoropolymer Resin

Everflon™ PFA GC403

Engineered for sub-nanometer semiconductor manufacturing with near-zero trace-metal elution.

Purity down to parts-per-trillion.

Designed to exceed the most stringent contamination controls in critical wafer fabrication processes.

< 0.1 ppb

Total Metal Extractables

Strict polymerization control eliminates ion elution into aggressive wet etching chemistries including HF, SPM, and SC1/SC2.

260°C

Continuous Service Temp

Maintains mechanical rigidity and chemical resistance under severe thermal cycling and high-temperature acid circulation.

> 500,000

MIT Flex Life

Industry-leading resistance to environmental stress cracking under constant mechanical pulsation and pressure loading.

Sub-Nanometer Contamination Control

Ultra-High Purity Engineering

Engineered to eliminate yield-killing ionic and particulate contamination in advanced semiconductor fabs.

< 10 ppt

Critical Trace Metals

Extremely low baseline levels for critical metallic ions (Fe, Cu, Ni, Cr, Zn, Ca). Safeguards against lattice defects and gate-oxide degradation during advanced wet-etching steps.

Ultra-Low

Total Organic Carbon (TOC)

Advanced fluorination treatment minimizes non-fluorinated end groups, virtually eliminating organic leachables and chemical outgassing into UPW and high-purity chemical streams.

Ra < 0.1 μm

Sub-Micron Surface Finish

Smooth, non-porous interior surfaces prevent chemical entrapment and biological biofilm adhesion, shortening fab tool flush-out and qualification cycles.

100%

Fluorinated End-Group Stability

Complete conversion of unstable chain ends into inert $-CF_3$ groups guarantees zero bubble nucleation, low odor, and minimal color discoloration during molten processing.

Equivalent Reliability to Industry-Standard Semiconductor Resins

Everflon™ PFA GC403 provides an ultra-pure polymer matrix designed to match and exceed the chemical resistance, flexural longevity, and extractable profiles required for next-generation 3nm/2nm node fluid-handling assemblies.

Mission-Critical Systems

Semiconductor Applications

Engineered for extreme purity and mechanical integrity across modern sub-nanometer fab environments.

High-Purity Tubing & Piping

Extruded into ultra-smooth fluid tubing for Central Chemical Distribution Systems (CCDS) handling high-purity acids (HF, HNO₃, H₂SO₄) and solvent loops.

Valves, Fittings & Diaphragms

Injection and transfer molded into leak-free flare fittings, valve manifolds, and flexible pump diaphragms with industry-leading MIT flex life.

Wafer Carriers & Wet Benches

Used in precision wafer cassettes and immersion vessels, offering strict dimensional tolerances and zero ionic cross-contamination during SPM/SC-1 cleans.

Sensors & Chemical Linings

Provides robust dielectric insulation and chemical shielding for flowmeters, pressure sensors, and bulk chemical storage vessels.

SEMATECH & SEMI Standards Compliance

Everflon™ PFA GC403 is engineered to meet and exceed global SEMI standards for liquid chemical distribution materials, ensuring seamless qualification in cutting-edge 3nm/2nm fab construction.

Technical Specifications

Nominal property values for Everflon™ PFA GC403 semiconductor-grade fluoropolymer pellets.

Property Parameter	Test Standard	Unit	Nominal Value
Melt Flow Rate (372°C / 5.0 kg)	ASTM D1238 / D2116	g/10 min	1.8 – 2.5
Specific Gravity	ASTM D792	—	2.15
Tensile Strength (23°C)	ASTM D638	MPa (psi)	≥ 32 (4,640)
Ultimate Elongation	ASTM D638	%	≥ 350
Melting Peak Temperature	ASTM D3418	°C (°F)	305 – 310 (581 – 590)
Dielectric Constant (1 MHz)	ASTM D150	—	2.1

Fabrication & Logistics

Packaging & Processing

Class 100 cleanroom packaging integrity paired with optimized melt-processing parameters.

Cleanroom Packaging

Packaged in anti-static, multi-layer cleanroom-grade polyethylene bags (25 kg / 55 lb net) encased in sealed drums to prevent particulate and moisture contamination.

Processing Temperature

Typical melt temperatures range from 350°C to 390°C (662°F – 734°F). Melt temperature must not exceed 400°C (752°F) to avoid thermal decomposition.

Corrosion Tooling

All melt contact components (screws, barrels, tool dies, nozzles) must be constructed from high-nickel alloys such as Hastelloy® C-276 or Inconel® 625.

Recommended Extruder Heating Profile

Rear (Feed Zone): 330°C – 350°C | Middle (Compression): 350°C – 370°C | Front (Metering): 365°C – 385°C | Die / Adapter: 375°C – 390°C