PFA 430
Everflon™ PFA 430
Ultra-low viscosity fluoroplastic resin engineered with a typical MFR of 42. Built for maximum processing speed, ultra-fine wire insulation, and ppb-purity semiconductor parts.
Typical melt flow rate of 42 g/10 min permits unprecedented extrusion speeds and ultra-easy mold filling for intricate parts.
Enables thin-wall insulation of micro conductors, withstanding soldering heat without thermal degradation or distortion.
Specially synthesized for ultra-low extractables and improved color, designed for harsh semiconductor chemical filters.
Formulated to maintain excellent flexural modulus and stress-crack resistance despite its high melt flow performance.
Global Standards
Qualifies for direct food, ultrapure fluid, and pharmaceutical contact in full compliance with U.S. FDA regulations.
Certified under European plastic materials regulations for high-purity chemical and food handling safety.
Highest standard non-flammable resin classification with minimal smoke evolution and low heat contribution.
Processed with dedicated isolation techniques to eliminate airborne contamination and foreign inclusions.
Technical Specs
| Property | Test Method | Value (Standard / Imperial) |
|---|---|---|
| Melt Flow Rate (MFR) | ASTM D3307 / ISO 12086 | 38 – 45 g / 10 min (Typ. 42) |
| Melting Point | ASTM D4591 / DSC | 305 °C (581 °F) |
| Tensile Strength (23°C / 73°F) | ASTM D3307 / ISO 12086 | 25 MPa (3,600 psi) |
| Flexural Modulus (23°C / 73°F) | ASTM D790 / ISO 178 | 690 MPa (100,000 psi) |
| MIT Folding Endurance (0.20mm film) | ASTM D2176 | 4,000 Cycles |
| Continuous Service Temp | Thermal Aging Standard | 260 °C (500 °F) |
| Flammability Rating | UL 94 | V-0 |
Manufacturing
Low viscosity profile enables rapid coating over ultra-thin conductors using high-temperature draw-down techniques.
Recommended Barrel Temperature: ~390°C (730°F)
Corrosion-resistant nickel-based alloys mandatory for melt contact
Allows large die openings with drawdown ratios for high line speed
Effortlessly fills complex multi-cavity semiconductor molds and intricate electrical sleeving without flash or strain.
Reciprocating screw machines preferred
Reduces cycle times by up to 30% compared to standard MFR PFA
Ensures flawless surface finish and precise dimensional tolerances
Serving mission-critical semiconductor fabrication and aerospace electronics nationwide.
High-speed thin-wall insulation for medical sensor wiring, aerospace coax cabling, and high-density electronics sleeving.
Fluid handling housings and filter cores requiring purity in the parts-per-billion range for aggressive chemical lines.
Thin-walled connectors, miniature fittings, and multi-cavity injection molded components with high detail complexity.
Isolation & Packaging
Everflon™ PFA 430 is produced under special isolation protocols to eliminate airborne contaminants and ensure ultrapure quality upon delivery.
Standard Packaging: 25-kg (55.1 lbs) sealed multilayer bags with an integral ultra-clean PE liner.
Storage Protocol: Ambient dry isolation; properties remain unaffected indefinitely under clean conditions.
Freight Class: Classified as "Plastics, Materials, Pellets" for U.S. logistics shipping.
Environmental Stewardship
High-speed flow properties drastically reduce molding processing energy while eliminating material defects in ultra-thin manufacturing.
Rapid flow properties lower extrusion back-pressure, reducing overall plant kilowatt consumption per batch.
Maintains fluid purity in chemical manufacturing without releasing hazardous organic byproducts or fluorides.
Ultra-low viscosity eliminates short-shots in multi-cavity molds, drastically dropping scrap material rates.
Everflon™ is a trademark of Everflon Fluoropolymers. All rights reserved.
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Significant Others
Everflon™+ PFA Color Concentrate
Everflon™+ PFA Compound
Everflon™ PFA Aqueous Dispersion
Everflon™ PFA Roto Molding Powder
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