FEP Foam PF4630

Ultra-High MFR Miniature Foam Resin

Everflon+ FEP PF4630

Engineered with an ultra-high melt flow rate (MFR 30) for foamed primary dielectric insulation in twisted pair cables and miniature coaxial lines, empowering ultra-thin walls and minimal signal distortion.

Engineered for Ultra-Fine Gauges & Extreme Thin Walls

Everflon+ FEP PF4630 combines an exceptionally high melt flow with advanced foaming technology to enable micro-coaxial and twisted pair innovations.

01

Ultra-High Melt Flow (MFR 30)

Boasts an exceptional MFR of 30, providing superior fluidity for high-speed extrusion of ultra-thin wall sections and fine wire designs.

02

Fine Gauge & Thin-Wall Capability

Optimized for conductor sizes of 32 AWG or greater and insulation wall thicknesses of 0.004 in (0.10 mm) or greater with uniform closed cells.

03

High-Frequency Signal Fidelity

Reduces dielectric constant significantly via 20% to 65% void content, delivering miniature cables for high-frequency signal transmission with minimal distortion.

Industry Applications

Tailored for ultra-fine electronic cabling, high-density data transmission, and micro-coaxial systems.

Data & Networking

Twisted Pair Cables

Ideal for producing foamed primary dielectric insulation for high-performance twisted pair data cables requiring precise fine-gauge insulation.

Micro-Electronics

Miniature Coaxial Cables

Delivers exceptional performance for miniature coaxial cable cores where conductor sizes are 32 AWG or greater and space is severely constrained.

Advanced Systems

High-Frequency Transmission

Enables lightweight, miniaturized signal paths designed to support high-frequency signal transmission with extreme precision and minimal loss.

Technical Property Data

Typical physical, processing, and electrical characteristics for Everflon+ FEP PF4630 resin.

Property DescriptionTest MethodUnitTypical Value
Processing & Rheology
Melt Flow Rate (MFR at 372 °C / 5.0 kg)ASTM D2116 / ISO 12086g / 10 min30
Melting PointASTM D4591°C (°F)260 (500)
Specific GravityISO 1183 / ASTM D7922.14
Electrical Properties
Dielectric Constant (1 kHz / 1 MHz / 1 GHz)ASTM D150 / IEC 2502.04
Dissipation Factor (1 kHz)ASTM D150 / IEC 2500.0001
Dissipation Factor (1 MHz)ASTM D150 / IEC 2500.0006
Dissipation Factor (1 GHz)ASTM D150 / IEC 2500.0005

Extrusion & Processing Guide

Optimized for conventional single-screw extruders with nitrogen gas injection systems.

Step 01

Equipment Materials

Process contact metals must be high-nickel, low-iron alloys suitable for fluoroplastic extrusion to prevent equipment corrosion.

Step 02

Void Content Control

Void content (20% to 65%) is controlled by nitrogen flow rate, process temperatures, and quench point. Voids should grow after melt draw-down onto the wire.

Step 03

Color Addition

When adding color concentrates, use one compounded in FEP fluoroplastic. Note that color addition may affect cell formation and capacitance.

Step 04

Packaging & Storage

Supplied as white pellets in 55-lb (25-kg) bags or 1,000-kg boxes. Store in dry ambient conditions avoiding airborne contamination and water condensation.

Safety Precaution

Handling & Ventilation

Process only in well-ventilated areas using local exhaust ventilation (LEV). Vapors and fumes liberated during hot processing must be exhausted completely from the work area.

Avoid tobacco contamination. Inhaling fumes from contaminated tobacco can cause polymer fume fever (chills, fever, sore throat), which typically passes within 24 hours.

Regulatory Notice

Authorization & Medical Use

Customers wishing to process these products should consult sales representatives to obtain a license authorizing the processing of cable primaries.

Caution: Do not use or resell materials in medical applications involving human body implantation without a written agreement covering such use.

Foamed FEP. More Than Lightweight.

Lighter. Smarter. More Possibilities.

Meet the Everflon™ FEP all-stars.

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