FEP 4630
Ultimate flow. Micro-precision unleashed.
Engineered for maximum extrusion velocity, ultra-thin wall jackets, and zero-compromise micro-molding.
Ultra-High MFI Benchmark (30.0 g/10min): Unlocks maximum melt delivery to effortlessly coat ultra-fine wires and micro-tubing walls without voids. Sustains impeccable melt stability at elevated extruder line speeds to drastically elevate production yield.
Melt Fracture Suppression: Precise control over molecular weight distribution stops melt fracture at hyper line speeds, delivering glass-smooth, defect-free surfaces. Near-zero moisture absorption (<0.01%) ensures cleanroom-level purity for critical devices.
Lossless High-Frequency Propagation: Features a low relative permittivity of 2.03 and minimal dissipation factor. Delivers pure signal transmission for AI server interconnects, 5G/6G lines, alongside >100 kV/mm high-voltage insulation protection.
UL 94 V-0 Safety & Chemical Immunity: Limiting Oxygen Index (LOI) >95% with low smoke generation. Resists aggressive acids, caustic chemicals, and organic solvents continuously at operating temperatures up to 205 °C (400 °F).
Premium thin-wall insulation engineered for high-density AI cluster interconnects, aerospace micro-wiring harnesses, and low-attenuation 5G/6G data lines requiring maximum transmission velocity.
Fabricates crystal-clear, ultra-pure, anti-corrosion micro-catheters and precision fluid delivery lines for semiconductor wet benches, chromatography, and critical surgical devices.
Superior cavity filling performance for micro anti-corrosion valve components, chemical pump miniature seals, precision electronic packaging, and intricate thin-wall fittings.
| Property | Test Method | Typical Value | Assessment & Engineering Notes |
|---|---|---|---|
| Melt Flow Index (MFI) | ASTM D2116 | 30.0 g/10 min | Maximum throughput & micro-fill capability |
| Specific Gravity | ASTM D792 | 2.15 | Dense, ultra-high purity structure |
| Tensile Strength | ASTM D638 | 20 MPa | Strong mechanical endurance under continuous stress |
| Elongation at Break | ASTM D638 | 300 % | Exceptional plastic flexibility for fine wire bending |
| Izod Impact Strength (23 °C) | ASTM D256 | No Break | High-impact shock absorption and ductility |
| Dielectric Strength (0.25 mm) | IEC 243 / ASTM D149 | > 100 kV/mm | Robust high-voltage insulation and surge defense |
| Relative Permittivity (1 GHz) | IEC 250 / ASTM D150 | 2.03 | Lossless high-frequency signal propagation |
| Limiting Oxygen Index (LOI) | ISO 4589 / ASTM D2863 | > 95 % | UL 94 V-0 top-tier flammability rating |
| Continuous Service Temp. | --- | 205 °C / 400 °F | Engineered for extreme continuous thermal environments |
Supplied in uniform 3 mm (0.12 in) dust-free pellets for smooth, bubble-free extruder feeding and high cavity pressure repeatability.
Processable via melt extrusion, micro-injection, and blow molding. Recommend corrosion-resistant nickel alloys (Hastelloy, Inconel) up to 400°C.
Standard heavy-duty 25-kg (55.1-lb) sealed drums lined with double-layer moisture-proof polyethylene bags to safeguard pristine cleanliness.
Everflon™ FEP 4630 achieves top-tier UL 94 V-0 flammability classification with an LOI exceeding 95%. Fully compliant with strict U.S. National Electrical Code (NEC) plenum wiring standards and aerospace flame barrier requirements.
Strictly manufactured without restricted hazardous substances. 100% compliant with EU RoHS Directive 2011/65/EU (and 2015/863) and certified free of REACH Substances of Very High Concern (SVHC) for clean international export.
Manufactured using modern fluorination synthesis containing zero non-compliant PFOA/PFOS surfactants. Complies with FDA 21 CFR 177.1550 criteria for high-purity medical catheters, food contact, and semiconductor fluid handling.
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