ETFE Cross Linkable X4010

XLETFE Radiation Cross-Linkable Wire Polymer

Everflon+™ ETFE X4010.
E-Beam Cross-Linking. Extreme Thermal Insulation.

Engineered for aerospace wire harnesses, automotive thin-wall wiring, and high-temperature electronic equipment. Powered by electron-beam irradiation to deliver exceptional solder resistance, mechanical toughness, and thermal aging stability.

8 ~ 15 g/10min
MFI (Melt Flow Index)
200+ °C
Short-Term Limit Rating
150 °C
Continuous Service Temp
Solder Iron
Melt-Resistant Shield

XLETFE Radiation Cross-Linking Architecture

Molecular Reinforcement Beyond Traditional Thermoplastics

Radiation Cross-Linkable

Electron-Beam (E-Beam) Bridging Technology

Everflon+™ ETFE X4010 is optimized for high-efficiency electron-beam irradiation. Following wire extrusion or molding, controlled exposure induces robust three-dimensional polymer network cross-linking, completely eliminating high-temperature flow deformation typical of standard thermoplastics.

Superior Solder Resistance

Eliminates Hot Iron Meltback

During high-density electronic harness assembly and manual soldering, the cross-linked XLETFE insulation layer exhibits exceptional immunity to thermal melting and shrinkage, securing terminal integrity.

Mechanical Abrasion Defense

Exceptional Cut-Through & Scratch Resistance

The cross-linked molecular matrix provides high surface hardness and cut-through durability, easily withstanding tight automotive routing friction and harsh aerospace dynamic pulling forces.

Thin-Wall Lightweight Design

Enhanced Strength Enables Extreme Wire Harness Weight Savings

Because cross-linking multiplies mechanical resilience, wire designs can incorporate thinner insulation walls while maintaining superior dielectric performance, significantly reducing overall harness weight for aerospace and EV efficiency.

Technical Specifications

Typical Property Data

Standard ASTM / ISO laboratory test values for Everflon+™ ETFE X4010 (Pre-crosslink base MFI 8–15, Metric units).

Property ParameterTest MethodUnit (Metric)Typical Value (Base / Post-Crosslink)
Melt Flow Index (MFI @ 297 °C / 5.0kg)ASTM D3159g/10 min8.0 – 15.0 (Nominal 11.5)
Melting PointDSC°C255 – 265
Specific GravityASTM D792g/cm³1.70 – 1.72
Tensile Strength at BreakASTM D638MPa≥ 45
Tensile Elongation at BreakASTM D638%≥ 300
Continuous Service TemperatureUL Standard°C150 (Short-term rating 200°C)
Thermal Deformation / Solder ResistanceISO / IEC SpecExcellent (Zero Melt Flow)
Flammability RatingUL94V-0

Extrusion & Irradiation Guidelines

Wire Extrusion, E-Beam Parameters & Target Applications

01. High-Speed Wire Insulation Extrusion

Thin-Wall Coating & Stable Parameters

Optimized for high-speed tubular or pressure extrusion lines. Recommended melt temperatures range from 320°C to 360°C. Featuring an MFI of 8–15, it balances melt flow and draw-down tension for uniform concentricity on fine-gauge conductors.

02. Electron-Beam (E-Beam) Irradiation

Precise Dosimetry & 3D Network Building

Extruded wires are routed through an electron accelerator for cross-linking. Optimized dosage levels lock in superior thermal endurance, cut-through protection, and high-temperature solder melt resistance.

03. Conductor & Equipment Compatibility

Tinned / Silver-Plated Copper

Seamlessly compatible with tinned copper, silver-plated copper, and high-strength alloy conductors. Extruder fluid-contact parts should utilize corrosion-resistant alloy steels for continuous production runs.

Target Applications for Extreme Wire & Cable Markets

Aerospace & Defense High-Temp Wire Harnesses          Lightweight, thin-wall aircraft hook-up wires complying with rigorous aerospace specifications, withstanding severe mechanical vibration and extreme thermal ranges.
Automotive Engine Bay & Sensor Wiring          Thin-wall signal and power cables for EV and ICE engine compartments demanding solder-iron resistance and long-term thermal aging protection.
High-End Industrial & Server Internal Interconnects          High-density electronic internal wiring that avoids insulation melt deformation during automated mass soldering operations.

Logistics & Safety Protocols

Packaging, Storage & Safe Handling Guidelines

Standard Packaging

Supplied as uniform, dust-free cross-linkable ETFE pellets optimized for wire extrusion feeding.

25-kg / 45.4-kg Heavy-Duty Drums (Metric)
Hermetically sealed with a moisture-barrier polyethylene inner liner.

Storage & Pre-Drying

Resin properties remain stable under ambient dry storage. Protect containers from airborne contamination and moisture condensation.

Drying: 100°C to 120°C for 3 to 4 Hours
Recommended prior to high-speed extrusion to ensure flawless insulation concentricity.

Safety Precautions & Ventilation

Process only in well-ventilated areas with Local Exhaust Ventilation (LEV) to evacuate thermal processing fumes.

Avoid Tobacco Contamination
Prevent polymer fume fever by keeping tobacco free from resin dust. Consult the Safety Data Sheet (SDS).

Technical Data & Warranty Disclaimer

The information set forth herein is furnished free of charge and based on technical data believed to be reliable. It is intended for use by persons having technical skill at their own discretion and risk. Because conditions of product use are outside our control, no warranties, express or implied, are made regarding final component performance.

Medical & Critical Implantation Restriction

Do not use or resell Everflon+™ materials in medical applications involving permanent implantation in the human body or contact with internal body fluids or tissues unless agreed to in a formal written contract.

Safe Handling Guidelines & Standards

Before processing resin, consult the Safety Data Sheet (SDS) and "The Guide to the Safe Handling of Fluoropolymer Resins," published by the Plastics Industry Association (www.plasticsindustry.org) or PlasticsEurope (www.plasticseurope.org).

© 2026 Everflon+ Performance Fluoropolymers. All rights reserved.
Typical properties are not suitable for specification purposes.

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