FEP Dispersion D50
Everflon™ Fluoropolymers
Off-white aqueous FEP dispersion engineered for heat-sealable top-coats and chemical barrier coatings from -400°F to 400°F.
Designed to solve complex thermal bonding and anti-corrosion challenges.
Fuses at lower temperatures than PTFE, making it the premier choice for heat-sealable top-coats on PTFE glass fabrics.
Acts as an effective liquid hot melt adhesive to bond PTFE, PFA, and FEP molded parts or film structures together.
Forms smooth, transparent, non-porous films that offer high chemical impermeability and non-wetting electrical isolation.
Stabilized formulation allows precise thin-layer deposition (< 5 μm) avoiding mud-cracking during drying cycles.
Empowering high-performance manufacturing across North America.
Compatible with dip, spray, spin, or roller coating techniques.
Apply thin coats (< 5 μm / 0.2 mil) per pass to avoid mud cracking during drying cycles.
Evaporate water content at 120 °C (250 °F) prior to surfactant bake-off.
Decompose non-ionic surfactant completely at 250–270 °C (482–518 °F).
Melt-fuse particles into a continuous film above 280–310 °C (536–590 °F).
Packaged for safety, extended shelf-life, and seamless storage.
Ideal for pilot batch production, high-value specialty coatings, and R&D testing.
Engineered for continuous commercial manufacturing and automated filling lines.
Pair Everflon™ FEP D50 with our complementary fluoropolymer dispersions.
60% solids aqueous PTFE dispersion with 210nm spherical particles for superior fabric coating and wetting.
Learn more >Higher-temperature aqueous PFA dispersion engineered for extreme thermal stability up to 500°F.
Learn more >Precision by the Numbers.
High-Performance Fluorinated Ethylene Propylene Aqueous Dispersion Matrix
| Category | Technical Properties | Test Method | Typical Value |
|---|---|---|---|
| Physical Properties | Solid Content (wt%) | ASTM D4441 | 50% |
| Average Particle Size (μm) | ASTM D4441 | 0.25 μm | |
| Dispersion pH Value | ASTM D4441 | 9.0 – 10.0 | |
| Rheology & Melt Flow | Brookfield Viscosity (mPa·s) | ASTM D4441 | 15 – 30 mPa·s |
| Melt Flow Index (MFI, g/10min @372°C, 5kg) | ASTM D2116 | 8.0 – 12.0 | |
| Thermal Performance | Base Resin Melting Point | ASTM D2116 | 260 °C / 500 °F |
| Process Characteristics | • Exceptional Shear Stability: Engineered for precision coating and demanding impregnation processes; highly resistant to coagulation under high shear rates. • Superior Adhesion Profile: Enhances structural bonding to metallic surfaces (e.g., SUS316L, copper foils) and fiberglass substrates, delivering premium corrosion resistance. • Low Settling Tendency: Formulated with premium non-ionic surfactants ensuring stellar long-term shelf-life and dilution stability. | ||
Semiconductor wet processing equipment lining, high-frequency 5G/6G RF coaxial data cables, aerospace insulation, and architectural high-performance fiberglass membranes.
Optimized for standard industrial methodologies including Spray Coating, Roller Coating, and automated Continuous Dip Impregnation lines.
Disclaimer: The technical data provided herein represents typical properties based on standardized laboratory evaluations (e.g., ASTM D4441/D2116) and should not be used as absolute product specifications. End-users are strongly advised to perform independent testing on specific substrate matrices (e.g., critical copper alloys, woven fiberglass, specialized liners) to verify exact sintering profiles, thermal stress boundaries, and adhesion performance for compliance with specialized regulatory parameters.
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