PVDF 2010

Get to know Everflon™ PVDF H2010.

EverflonTM Fluoroplastic PVDF H2010 is ideal for compression molding and extrusions requiring good strength and dimensional stability Our PVDF provides good chemical resistance to abroad range of fluids and solvents while maintaining mechanical properties at elevated temperatures, This medium melt flow PVDF homopolymer is suitable for compression molding and extrusion processes.

EverflonTM Fluoroplastic PVDF H2010 is a homopolymer of vinylidene difluoride (VDF) that provides good resistance to a variety of fluids. PVDF H2010 can be used in compresion molded parts and extrusions with good permeation resistance. This is a medium melt flow index PVDF homopolymer making it suitable for compression molding and extrusion processes.

More details please visit www.everflon.com for Everflon PVDF Tech Book.


Precaution

Equipment used to process at melt temperatures should be provided with local exhaust ventilation (LEV) to completely remove all fumes and vapors from the processing area. In addition, care should be exercised to avoid the contamination of cigarettes and other forms of smoking tobacco when using fluoroplastic resins. Before processing any fluoroplastics, read the Material Safety Data Sheet.

Data List

PropertyTest MethodUnitTypical Value
Physical
Specific GravityISO 1183
1.78
Melt Flow IndexASTM D12386 g/10 min230℃, 5 kg

ASTM D12382 g/10 min230℃,2.16 kg
Mechanical
Tensile StrengthASTMD638

Yield,23°C,50mm
Mpa/psi55/7975
Break,23°C,50mm
Mpa/psi42/6090
Tensile ElogationASTMD638

Yield,23°C,50mm
%7
Break,23°C,50mm
%35
Thermal
Melting Point (Crystallinity by DSC)ASTM D3418174
Flexural ModulusASTM D790Mpa/psi2200/319,000
Deflection Temperature (4mm Thick)ASTM D648Mpa/MpLoad 0.46/Load 1.82
Molding Shrinkage
%3
Electrical
UL-94Flammability TestUL - 94
V-0 Class
Limiting Oxygen IndexASTM D2863%44


Handing & Package

EverflonTM Fluoroplastic PVDF should be stored in a clean, dry, uncontaminated place with packaging intact. Everflon PVDF generally does not require drying before processing unless high humidity conditions create surface moisture adsorption.Opened containers should be tightly resealed to prevent dust contamination from static charge accumulation and moisture ingress.

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